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Miraial has been recognized by Semiconductor Review Magazine as “Top 10 Semiconductor Fabrication Solutions Companies in APAC - 2024” based on our proprietary methodology, reflecting its position in the industry. This profile has been developed by the Semiconductor Review research and editorial team based on insights from an interview with Masatoshi Hyobu, President and CEO.
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The genesis of 300mm FOSB and FOUP can be traced back to the collaboration between the largest US device maker and Japanese wafer maker, and Miraial. The company innovates and customizes wafer carriers to accommodate quality and performance-upgraded chips in accordance with specific client requirements.
“We modify and improve the FOSB/FOUP production process and product designs/functions according to the voice of our customers (VOC) to meet their cleanliness and handling requirements. This approach has resulted in the official launch of 30 to 40 different product variations,” says Takamasa Kato, executive director at Miraial Co.
To develop carriers that protect wafers from visible and invisible contaminants, selecting and combining multiple high-purity plastics is imperative. Miraial collaborates with chosen plastic resin suppliers to acquire premium raw materials for manufacturing FOSB and FOUP that meet client’s cleanliness standards. Apart from raw material selection, the firm implements cleanroom operation processes in its manufacturing plants to ensure high-purity final product.
Miraial’s commitment to quality entails stringent control over the entire manufacturing processes to maintain a pristine environment. Metal molds and injection machines used for production of FOSB and FOUP are also developed within its in-house facility. This enables the plastic molding company to sustain superior product quality, eliminating the possibility of invisible contamination like metal ions and particles during the manufacturing and shipping processes.
For instance, a client’s technical experts of device maker approached Miraial to improve FOSB for handling of chips with single nano features. Each performance improvement requires customized high-purity carrier boxes to reduce contamination while transporting wafers and chips from wafer makers to device makers. In response, the plastic molding company selected premium plastic base materials of high-purity and modified its cleanroom operation processes to enhance cleanliness to launch new varieties of FOSB in the market.
The company relies on its massive team of technology experts and heavily invests in technical innovation and analytical tools utilized by leading semiconductor and wafer manufacturing companies to provide clients with customized offerings. In addition, it regularly optimizes daily operations at manufacturing plants and maintains strong relationships with global distributors to ensure the timely delivery of FOSB and FOUP.
The firm aims for carbon neutrality despite the substantial energy required to manufacture plastic-based FOSB and FOUP. It is actively implementing a new business strategy of recycling its product offerings to reduce waste and minimize disposal. For instance, the new 300 mm FOSB is designed to enable easy replacement of product parts. In addition, the firm strives to use a single variety of resin for each part, facilitating easy separation and recycling of the final product. These proactive approaches to align high-purity 300mm FOSB and FOUP with VOC and market trends have been major determinants for Miraial in earning its title as the industry leader for the past 25 years.
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Company
Miraial
Management
Masatoshi Hyobu, President and CEO
Description
Miraial providesinnovative value through the development of advanced-function plastic products. Its initiative to tailor products according to client requirements has resulted in the creation of a vast portfolio of wafer transportation boxes and the title of market leader for the past 25 years.